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BSCQ000603033N3B00|PULSE|simage
BSCQ000603033N3B00|PULSE|limage
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BSCQ000603033N3B00

Inductor RF Chip Multi-Layer 0.0033uH 0.1nH 500MHz 14Q-Factor Ceramic 0.415A 0.28Ohm DCR 0201 T/R

Pulse Electronics
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Specifiche Tecniche del Prodotto
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8504.50.80.00
  • Automotive
    No
  • PPAP
    No
  • Type
    RF Chip
  • Technology
    Multi-Layer
  • Core Material
    Ceramic
  • Inductance (H)
    0.0033u
  • Inductance Decrease Percentage @ Isat (%)
    10
  • Tolerance
    0.1nH
  • Inductance Test Frequency (Hz)
    500M
  • Maximum DC Current (A)
    0.415
  • Maximum Saturation Current (A)
    0.415
  • Maximum DC Resistance (Ohm)
    0.28
  • Minimum Quality Factor
    14
  • Quality Test Frequency (Hz)
    500M
  • Minimum Self Resonant Frequency (Hz)
    8600M
  • Number of Terminals
    2
  • Case Size
    0201
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Maximum Product Length (mm)
    0.63
  • Mounting
    Surface Mount
  • Maximum Product Depth (mm)
    0.33
  • Maximum Product Height (mm)
    0.33

Documentazione e Risorse

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Risorse di progettazione