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160000.02|SIBA|simage
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Fusibili

160000.0,2

Fuse Chip Slow Blow Acting 0.2A 250V SMD Solder Pad 4.5 X 8mm Ceramic

SIBA GmbH
Datasheets 

Product Technical Specifications
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Type
    Chip
  • Acting
    Slow Blow
  • Application
    Motor Circuit
  • Fuse Size (mm)
    4.5 X 8
  • Current Rating (A)
    0.2
  • Maximum Voltage Rating (V)
    250
  • Maximum AC Voltage Rating (V)
    250
  • Maximum Power Dissipation (W)
    0.26
  • Breaking Capacity @ Rated Voltage (A)
    100@250VAC
  • Typical Melting I2t (A²S)
    0.32
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Product Depth (mm)
    4.4
  • Product Length (mm)
    8
  • Product Height (mm)
    4.4
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount

Documentation and Resources

Datasheets
Design resources