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M29F400FB55N3E2|MICRON|simage
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Flash

M29F400FB55N3E2

NOR Flash Parallel 5V 4M-bit 512K x 8/256K x 16 55ns Automotive AEC-Q100 48-Pin TSOP Tray

Micron Technology
Hojas de datos 

Especificaciones técnicas del producto
  • RoHS (Unión Europea)
    Compliant
  • ECCN (Estados Unidos)
    EAR99
  • Estatus de pieza
    Obsolete
  • Código HTS
    8542.32.00.71
  • Automotive
    Yes
  • PPAP
    Unknown
  • Cell Type
    NOR
  • Chip Density (bit)
    4M
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Block Organization
    Asymmetrical
  • Location of Boot Block
    Bottom
  • Address Width (bit)
    19/18
  • Sector Size
    8Kbyte x 2|16Kbyte x 1|32Kbyte x 1|64Kbyte x 7
  • Number of Bits/Word (bit)
    8/16
  • Number of Words
    512K/256K
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    55
  • Maximum Erase Time (s)
    30/Chip
  • Maximum Programming Time (ms)
    15000/Chip
  • OE Access Time (ns)
    20
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    4.5
  • Typical Operating Supply Voltage (V)
    5
  • Maximum Operating Supply Voltage (V)
    5.5
  • Programming Voltage (V)
    4.5 to 5.5
  • Operating Current (mA)
    20
  • Program Current (mA)
    30
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    125
  • Supplier Temperature Grade
    Automotive
  • Command Compatible
    No
  • ECC Support
    No
  • Support of Page Mode
    No
  • Minimum Endurance (Cycles)
    100000
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1
  • Package Width
    18.4
  • Package Length
    12
  • PCB changed
    48
  • Standard Package Name
    SO
  • Supplier Package
    TSOP
  • Pin Count
    48
  • Lead Shape
    Gull-wing

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Cantidad de Pedido

Documentación y Recursos

Hojas de datos
Recursos de diseño