Módulos y circuitos integrados de energía especializados

DLPC230STZDQQ1

Digital Micromirror Device 324-Pin BGA Tray Automotive AEC-Q100

Texas Instruments

Especificaciones técnicas del producto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Codice HTS

  8542.31.00.30

• SVHC

  Yes

• Automotive

  Yes

• PPAP

  Yes

• Type

  Digital Micromirror Device

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Mounting

  Surface Mount

• Package Height

  1.73

• Package Width

  23.2(Max)

• Package Length

  23.2(Max)

• PCB changed

  324

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  324