Flash
S29GL128S10DHIV20
NOR Flash Parallel 3V/3.3V 128M-bit 8M x 16 100ns 64-Pin Fortified BGA Tray
Infineon Technologies AGEspecificaciones técnicas del producto
RoHS (Unión Europea)
Compliant
ECCN (Estados Unidos)
3A991b.1.a.
Estatus de pieza
Active
Código HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
NOR
Chip Density (bit)
128M
Architecture
Sectored
Boot Block
Yes
Block Organization
Symmetrical
Location of Boot Block
Bottom|Top
Address Width (bit)
23
Sector Size
128Kbyte x 128
Page Size
32byte
Number of Bits/Word (bit)
16
Number of Words
8M
Programmability
Yes
Timing Type
Asynchronous
Max. Access Time (ns)
100
Maximum Erase Time (s)
1.1/Sector
Maximum Page Access Time (ns)
25
Maximum Programming Time (ms)
192/Sector
OE Access Time (ns)
35
Process Technology
65nm
Interface Type
Parallel
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3.3|3
Maximum Operating Supply Voltage (V)
3.6
Programming Voltage (V)
2.7 to 3.6
Operating Current (mA)
60
Page Read Current (mA)
25
Program Current (mA)
100
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
Yes
Minimum Endurance (Cycles)
100000
Packaging
Tray
Mounting
Surface Mount
Package Height
0.6(Min)
Package Width
9
Package Length
9
PCB changed
64
Standard Package Name
BGA
Supplier Package
Fortified BGA
Pin Count
64
Lead Shape
Ball