Flash
S25FL512SAGBHIC13
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 512M/256M/128M x 1/2-bit/4-bit 14.5ns 24-Pin BGA T/R
Infineon Technologies AGEspecificaciones técnicas del producto
RoHS (Unión Europea)
Compliant
ECCN (Estados Unidos)
3A991b.1.a.
Estatus de pieza
Active
Código HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
NOR
Chip Density (bit)
512M
Architecture
Sectored
Boot Block
Yes
Block Organization
Symmetrical
Location of Boot Block
Bottom|Top
Address Width (bit)
32
Sector Size
256Kbyte x 256
Page Size
512byte
Number of Bits/Word (bit)
1/2/4
Number of Words
512M/256M/128M
Programmability
Yes
Timing Type
Synchronous
Max. Access Time (ns)
14.5
Maximum Erase Time (s)
460/Bulk
Maximum Programming Time (ms)
0.75/Page
Process Technology
65nm
Interface Type
Serial (SPI, Dual SPI, Quad SPI)
Minimum Operating Supply Voltage (V)
2.7
Maximum Operating Frequency (MHz)
133
Typical Operating Supply Voltage (V)
3|3.3
Maximum Operating Supply Voltage (V)
3.6
Programming Voltage (V)
2.7 to 3.6
Operating Current (mA)
100
Program Current (mA)
100
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
No
Minimum Endurance (Cycles)
100000
Mounting
Surface Mount
Package Height
1.2(Max) - 0.2(Min) mm
Package Width
6 mm
Package Length
8 mm
PCB changed
24
Standard Package Name
BGA
Supplier Package
BGA
Pin Count
24
Lead Shape
Ball