Chips DRAM

K4F6E3S4HM-GHCL02V

DRAM Chip Mobile LPDDR4 SDRAM 16Gbit 512Mx32 1.1V/1.8V 200-Pin FBGA

Samsung Electronics

Especificaciones técnicas del producto

• RoHS (Unión Europea)

  Compliant

• ECCN (Estados Unidos)

  EAR99

• Estatus de pieza

  Obsolete

• Código HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  16G

• Organization

  512Mx32

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  4266

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  200

• Lead Shape

  Ball