Chips DRAM

K4E6E304EB-EGCF

DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA

Samsung Electronics

Especificaciones técnicas del producto

• RoHS (Unión Europea)

  Supplier Unconfirmed

• ECCN (Estados Unidos)

  EAR99

• Estatus de pieza

  Active

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR3 SDRAM

• Chip Density (bit)

  16G

• Organization

  512Mx32

• Number of Internal Banks

  8

• Number of Words per Bank

  64M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  1866

• Minimum Operating Temperature (°C)

  -25

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• Package Width

  11

• Package Length

  11.5

• PCB changed

  178

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  178