Chips DRAM

IS43TR16512B-125KBL

DRAM Chip DDR3 SDRAM 8Gbit 512Mx16 1.5V 96-Pin TW-BGA

Integrated Silicon Solution Inc

Especificaciones técnicas del producto

• RoHS (Unión Europea)

  Compliant

• ECCN (Estados Unidos)

  EAR99

• Estatus de pieza

  Active

• Código HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3 SDRAM

• Chip Density (bit)

  8G

• Organization

  512Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  64M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1600

• Address Bus Width (bit)

  19

• Minimum Operating Supply Voltage (V)

  1.425

• Maximum Operating Supply Voltage (V)

  1.575

• Operating Current (mA)

  207

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  10

• Package Length

  14

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  96

• Lead Shape

  Ball