Fusibili

0685P9250-01

Fuse Chip Fast Acting 25A 50V SMD Solder Pad 1206 3.2 X 1.58 X 0.63mm Ceramic T/R Automotive AEC-Q200

Bel Power Solutions

Especificaciones técnicas del producto

• RoHS (Unione Europea)

  Compliant

• ECCN (Stati Uniti)

  EAR99

• Stato del componente

  Active

• Codice HTS

  8536.10.00.40

• Automotive

  Yes

• PPAP

  Unknown

• Type

  Chip

• Acting

  Fast

• Application

  Automotive Navigation System|Industrial Equipment|Medical Equipment|Notebook|Office Electronic Equipment

• Fuse Size (mm)

  3.2 X 1.58 X 0.63

• Current Rating (A)

  25

• Maximum Voltage Rating (V)

  50

• Maximum DC Voltage Rating (V)

  50

• Maximum Power Dissipation (W)

  1.25

• Typical Melting I2t (A²S)

  225

• Typical Cold Resistance (Ohm)

  0.0016

• Termination Style

  Solder Pad

• Number of Terminals

  2

• Minimum Operating Temperature (°C)

  -55

• Maximum Operating Temperature (°C)

  125

• Packaging

  Tape and Reel

• Product Depth (mm)

  1.58

• Product Length (mm)

  3.2

• Product Height (mm)

  0.63

• Fuse Material

  Ceramic

• Mounting

  Surface Mount

• Package/Case

  1206