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TMS5703137CGWTMEP|TI|simage
TMS5703137CGWTMEP|TI|limage
Microcontrollers - MCUs

TMS5703137CGWTMEP

MCU 16-bit/32-bit ARM Cortex R4F RISC 3MB Flash 1.2V/3.3V 337-Pin NFBGA Tray

Texas Instruments

Product Technical Specifications
  • EU RoHS
    Not Compliant
  • ECCN (US)
    3A001a.2.c.
  • Part Status
    Active
  • HTS
    TMS5703137CGWTMEP
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Family Name
    Hercules TMS570
  • Instruction Set Architecture
    RISC
  • Device Core
    ARM Cortex R4F
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    180
  • Maximum Clock Rate (MHz)
    180
  • Data Bus Width (bit)
    16|32
  • Program Memory Type
    Flash
  • Program Memory Size
    3MB
  • RAM Size
    256KB
  • Data Memory Size
    64KB
  • Programmability
    Yes
  • Interface Type
    I2C/SPI/UART
  • Number of I/Os
    120
  • No. of Timers
    2
  • PWM
    44
  • Number of ADCs
    2
  • ADC Channels
    16/24
  • ADC Resolution (bit)
    12/12
  • USART
    0
  • UART
    1
  • USB
    0
  • SPI
    2
  • I2C
    1
  • I2S
    0
  • CAN
    3
  • Ethernet
    1
  • Watchdog
    1
  • Parallel Master Port
    No
  • Real Time Clock
    No
  • Special Features
    CAN Controller
  • Minimum Operating Supply Voltage (V)
    1.14|3
  • Typical Operating Supply Voltage (V)
    1.2|3.3
  • Maximum Operating Supply Voltage (V)
    1.32|3.6
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Supplier Temperature Grade
    Automotive
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.95(Max)
  • Package Width
    16.1(Max)
  • Package Length
    16.1(Max)
  • PCB changed
    337
  • Standard Package Name
    BGA
  • Supplier Package
    NFBGA
  • Pin Count
    337
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources