Digital Signal Processors - DSPs

TMS32C6713BZDPA200

DSP Floating-Point 32bit 200MHz 1600MIPS 272-Pin BGA Tray

Texas Instruments

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991a.2.

• Part Status

  Active

• HTS

  8542.31.00.35

• SVHC

  Yes

• Automotive

  No

• PPAP

  No

• Family Name

  TMS320

• Instruction Set Architecture

  Advanced VLIW

• Device Core

  C67x

• Core Architecture

  C67x

• Numeric and Arithmetic Format

  Floating-Point

• Data Bus Width (bit)

  32

• Device Million Instructions per Second (MIPS)

  1600

• RAM Size

  264KB

• Programmability

  No

• Interface Type

  I2C/SPI

• Device Input Clock Speed (MHz)

  200

• USART

  0

• UART

  0

• USB

  0

• SPI

  2

• I2C

  2

• I2S

  0

• CAN

  0

• Ethernet

  0

• Minimum Operating Supply Voltage (V)

  1.14|3.13

• Typical Operating Supply Voltage (V)

  1.2|3.3

• Maximum Operating Supply Voltage (V)

  1.32|3.47

• Minimum High Level Output Voltage (V)

  2.4

• Maximum Low Level Output Voltage (V)

  0.4

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Extended

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.87(Max)

• Package Width

  27.2(Max)

• Package Length

  27.2(Max)

• PCB changed

  272

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  272

• Lead Shape

  Ball