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TMS320C6713BZDP225|TI|simage
TMS320C6713BZDP225|TI|limage
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TMS320C6713BZDP225

DSP Floating-Point 32bit 225MHz 1800MIPS 272-Pin BGA Tray

Texas Instruments

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    Active
  • HTS
    COMPONENTS
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Family Name
    TMS320
  • Instruction Set Architecture
    Advanced VLIW
  • Device Core
    C67x
  • Core Architecture
    C67x
  • Numeric and Arithmetic Format
    Floating-Point
  • Data Bus Width (bit)
    32
  • Device Million Instructions per Second (MIPS)
    1800
  • RAM Size
    264KB
  • Programmability
    No
  • Interface Type
    I2C/SPI
  • Device Input Clock Speed (MHz)
    225
  • USART
    0
  • UART
    0
  • USB
    0
  • SPI
    2
  • I2C
    2
  • I2S
    0
  • CAN
    0
  • Ethernet
    0
  • Minimum Operating Supply Voltage (V)
    1.14|3.13
  • Typical Operating Supply Voltage (V)
    1.2|3.3
  • Maximum Operating Supply Voltage (V)
    1.32|3.47
  • Minimum High Level Output Voltage (V)
    2.4
  • Maximum Low Level Output Voltage (V)
    0.4
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    90
  • Supplier Temperature Grade
    Commercial
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.78
  • Package Width
    27
  • Package Length
    27
  • PCB changed
    272
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    272
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources