Application Processors and SOCs

TDA3MVRBFABFRQ1

SOC TDA3x C66x 367-Pin FCBGA T/R Automotive AEC-Q100

Texas Instruments

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991.a.1

• Part Status

  Active

• HTS

  8542.31.00.70

• Automotive

  Yes

• PPAP

  Yes

• Family Name

  TDA3x

• Device Core

  C66x

• Maximum Clock Rate (MHz)

  745

• Data Bus Width (bit)

  32

• RAM Size

  512KB

• Type

  System-On-Chip

• Processing Unit

  Microprocessor

• PWM

  1

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Interface Type

  CAN/Ethernet/I2C/SPI/UART

• SPI

  4

• I2C

  2

• I2S

  0

• UART

  3

• Data Cache Size

  32KB

• USB

  0

• Instruction Cache Size

  32KB

• USART

  0

• CAN

  2

• PCI

  0

• Ethernet

  3

• Programmability

  No

• Core Architecture

  C66x

• Ethernet Speed

  10Mbps/100Mbps/1000Mbps

• Mounting

  Surface Mount

• Package Height

  2.39

• Package Width

  15.12(Max)

• Package Length

  15.12(Max)

• PCB changed

  367

• Standard Package Name

  BGA

• Supplier Package

  FCBGA

• Pin Count

  367