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SN74V24510PAG|TI|simage
SN74V24510PAG|TI|limage
FIFOs Memory

SN74V245-10PAG

FIFO Mem Sync Dual Depth/Width Uni-Dir 4K x 18 64-Pin TQFP Tray

Texas Instruments

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.39.00.90
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    72K
  • Organization
    4Kx18
  • Configuration
    Dual
  • Data Bus Width (bit)
    18
  • Bus Directional
    Uni-Directional
  • Timing Type
    Synchronous
  • Maximum Clock Rate (MHz)
    100
  • Max. Access Time (ns)
    6.5
  • Minimum Operating Supply Voltage (V)
    3
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    35
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    70
  • Supplier Temperature Grade
    Commercial
  • Expansion Support
    Yes
  • Expansion Type
    Depth|Width
  • FWFT Support
    Yes
  • Retransmit Capability
    No
  • Packaging
    Tray
  • Programmability
    Yes
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max) mm
  • Package Width
    10.2(Max) mm
  • Package Length
    10.2(Max) mm
  • PCB changed
    64
  • Standard Package Name
    QFP
  • Supplier Package
    TQFP
  • Pin Count
    64
  • Lead Shape
    Gull-wing

Documentation and Resources

Datasheets
Design resources