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SFEM064GB1ED1TOA6F111STD|SWISSBIT|simage
SFEM064GB1ED1TOA6F111STD|SWISSBIT|limage
Flash

SFEM064GB1ED1TO-A-6F-111-STD

3D TLC NAND Flash Serial e-MMC 3.3V 512G-bit 512G/128G/64G x 1/4-bit/8-bit 153-Pin BGA Automotive AEC-Q100

Swissbit
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Part Status
    LTB
  • HTS
    8542.32.00.71
  • Automotive
    Yes
  • PPAP
    Unknown
  • Cell Type
    3D TLC NAND
  • Chip Density (bit)
    512G
  • Boot Block
    Yes
  • Number of Bits/Word (bit)
    1/4/8
  • Number of Words
    512G/128G/64G
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Interface Type
    Serial e-MMC
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    102
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Supplier Temperature Grade
    Automotive
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Mounting
    Surface Mount
  • Package Width
    11.5
  • Package Length
    13
  • PCB changed
    153
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    153

Documentation and Resources

Datasheets
Design resources