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SF3812F3500T2|BOURNS|simage
SF3812F3500T2|BOURNS|limage
Fusibili

SF-3812F3500T-2

Fuse Chip Fast Acting 35A 250V SMD Solder Pad 3812 10.1 X 3.1mm Ceramic T/R

Bourns
Datasheets 

Product Technical Specifications
  • RoHS (Unione Europea)
    Compliant with Exemption
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • Codice HTS
    8536.10.00.40
  • SVHC
    Yes
  • Tasso di SVHC superiore ai limiti consentiti
    Yes
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Fast
  • Application
    Battery Management System|Blade Computing|PC Server|Power Supply|Voltage Regulator Module
  • Fuse Size (mm)
    10.1 X 3.1
  • Current Rating (A)
    35
  • Maximum Voltage Rating (V)
    250
  • Maximum AC Voltage Rating (V)
    250
  • Breaking Capacity @ Rated Voltage (A)
    100@250VAC|150@125VAC|130@80VDC|300@72VDC
  • Typical Melting I2t (A²S)
    1320
  • Typical Cold Resistance (Ohm)
    0.0014
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    3.1
  • Product Length (mm)
    10.1
  • Product Height (mm)
    3.1
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    3812

Documentation and Resources

Datasheets
Design resources