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Fuses

SF-1206F500-2

Fuse Chip Fast Acting 5A 32V SMD Solder Pad 1206 Ceramic T/R UL

Bourns
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    COMPONENTS
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Fast
  • Application
    DVD|Battery Charger|Cell Phone|Digital Camera|Disk Drive|Industrial Controller
  • Fuse Size (mm)
    3.1 X 1.55 X 0.6
  • Current Rating (A)
    5
  • Maximum Voltage Rating (V)
    32
  • Maximum DC Voltage Rating (V)
    32
  • Typical Melting I2t (A²S)
    0.966
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -20
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.55
  • Product Length (mm)
    3.1
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206

Documentation and Resources

Datasheets
Design resources