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SF1206F1252|BOURNS|simage
SF1206F1252|BOURNS|limage
Fusibles

SF-1206F125-2

Fuse Chip Fast Acting 1.25A 63V SMD Solder Pad 1206 Ceramic T/R UL

Bourns
Datasheets 

Product Technical Specifications
  • RoHS (Unión Europea)
    Compliant
  • ECCN (Estados Unidos)
    EAR99
  • Estatus de pieza
    Active
  • Código HTS
    8536.10.00.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Fast
  • Application
    Battery Charger|Cell Phone|DVD|Digital Camera|Disk Drive|Industrial Controller
  • Fuse Size (mm)
    3.1 X 1.55 X 0.6
  • Current Rating (A)
    1.25
  • Maximum Voltage Rating (V)
    63
  • Maximum DC Voltage Rating (V)
    63
  • Typical Melting I2t (A²S)
    0.062
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -20
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    1.55
  • Product Length (mm)
    3.1
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    1206

Documentation and Resources

Datasheets
Design resources