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SF0603HIA450M2|BOURNS|simage
SF0603HIA450M2|BOURNS|limage
Fuses

SF-0603HIA450M-2

Fuse Chip 4.5A 32V SMD Solder Pad 1.6 X 0.8mm Ceramic T/R Automotive AEC-Q200

Bourns
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8536.10.00.40
  • Automotive
    Yes
  • PPAP
    Yes
  • Type
    Chip
  • Fuse Size (mm)
    1.6 X 0.8
  • Current Rating (A)
    4.5
  • Maximum Voltage Rating (V)
    32
  • Maximum DC Voltage Rating (V)
    32
  • Typical Melting I2t (A²S)
    2.68
  • Typical Cold Resistance (Ohm)
    0.015
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    0.8
  • Product Length (mm)
    1.6
  • Product Height (mm)
    0.8
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount

Documentation and Resources

Datasheets
Design resources