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SDINBDG48GXI2|WSTRNDIG|simage
SDINBDG48GXI2|WSTRNDIG|limage
Flash

SDINBDG4-8G-XI2

MLC NAND Flash Serial e-MMC 3.3V 64G-bit 153-Pin TFBGA Tray

Western Digital
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991b.1.a.
  • Part Status
    Active
  • HTS
    8542.32.00.51
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Cell Type
    MLC NAND
  • Chip Density (bit)
    64G
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Interface Type
    Serial e-MMC
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Extended
  • Command Compatible
    No
  • ECC Support
    No
  • Support of Page Mode
    No
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.48
  • Package Width
    11.5
  • Package Length
    13
  • PCB changed
    153
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    153

Documentation and Resources

Datasheets
Design resources