Flash

S25FL256SAGMFIG00

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 256M-bit 256M/128M/64M x 1/2-bit/4-bit 14.5ns 16-Pin SOIC W Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  256M

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Location of Boot Block

  Bottom|Top

• Address Width (bit)

  32

• Sector Size

  64Kbyte x 512

• Page Size

  256byte|512byte

• Number of Bits/Word (bit)

  1/2/4

• Number of Words

  256M/128M/64M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  14.5

• Maximum Erase Time (s)

  330/Bulk

• Maximum Programming Time (ms)

  0.75/Page

• Process Technology

  65nm

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  2.7

• Maximum Operating Frequency (MHz)

  133

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  100

• Program Current (mA)

  100

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  2.55(Max) mm

• Package Width

  7.5 mm

• Package Length

  10.3 mm

• PCB changed

  16

• Standard Package Name

  SO

• Supplier Package

  SOIC W

• Pin Count

  16

• Lead Shape

  Gull-wing