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NTHD3100CT1G|ONSEMI|simage
NTHD3100CT1G|ONSEMI|limage
MOSFETs

NTHD3100CT1G

Trans MOSFET N/P-CH Si 20V 2.9A/3.2A 8-Pin Chip FET T/R

onsemi
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8541.29.00.55
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Material
    Si
  • Configuration
    Dual Dual Drain
  • Channel Mode
    Enhancement
  • Channel Type
    N|P
  • Number of Elements per Chip
    2
  • Maximum Drain-Source Voltage (V)
    20
  • Maximum Gate-Source Voltage (V)
    ±12@N Channel|±8@P Channel
  • Maximum Continuous Drain Current (A)
    2.9@N Channel|3.2@P Channel
  • Maximum Drain-Source Resistance (mOhm)
    80@4.5V
  • Typical Gate Charge @ Vgs (nC)
    2.3@4.5V@N Channel|7.4@4.5V@P Channel
  • Typical Input Capacitance @ Vds (pF)
    165@10V@N Channel|680@10V@P Channel
  • Maximum Power Dissipation (mW)
    1100
  • Typical Fall Time (ns)
    1.5@N Channel|12.4@P Channel
  • Typical Rise Time (ns)
    11.7@P Channel|10.7@N Channel
  • Typical Turn-Off Delay Time (ns)
    9.6@N Channel|16@P Channel
  • Typical Turn-On Delay Time (ns)
    6.3@N Channel|5.8@P Channel
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    1.05 mm
  • Package Width
    1.65 mm
  • Package Length
    3.05 mm
  • PCB changed
    8
  • Supplier Package
    Chip FET
  • Pin Count
    8
  • Lead Shape
    Flat

Documentation and Resources

Datasheets
Design resources