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MPC8270ZQMIBA|NXP|simage
MPC8270ZQMIBA|NXP|limage
Microprocessors - MPUs

MPC8270ZQMIBA

MPU PowerQUICC II MPC82xx Processor RISC 32bit 266MHz 3.3V 516-Pin TEBGA Tray

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Not Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    LTB
  • HTS
    COMPONENTS
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Family Name
    PowerQUICC II MPC82xx Processor
  • Instruction Set Architecture
    RISC
  • Device Core
    603e
  • Core Architecture
    603e
  • Number of CPU Cores
    1
  • Data Bus Width (bit)
    32
  • Instruction Cache Size
    16KB
  • On-Chip Memory
    32KB/RAM
  • Maximum Speed (MHz)
    266
  • Interface Type
    Ethernet/I2C/SPI/UART/USB
  • UART
    1
  • USART
    0
  • Data Cache Size
    16KB
  • USB
    1
  • Multiply Accumulate
    No
  • SPI
    1
  • I2C
    1
  • I2S
    0
  • CAN
    0
  • Ethernet
    3
  • Ethernet Interface Type
    MII/RMII
  • Ethernet Speed
    10Mbps/100Mbps
  • Minimum Operating Supply Voltage (V)
    1.45
  • Maximum Operating Supply Voltage (V)
    1.6
  • I/O Voltage (V)
    3.3
  • Maximum Power Dissipation (mW)
    1100
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.95(Max)
  • Package Width
    27
  • Package Length
    27
  • PCB changed
    516
  • Standard Package Name
    BGA
  • Supplier Package
    TEBGA
  • Pin Count
    516
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources