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MK64FX512VDC12|NXP|simage
MK64FX512VDC12|NXP|limage
Microcontrollers - MCUs

MK64FX512VDC12

MCU 32-bit ARM Cortex M4 RISC 512KB Flash 2.5V/3.3V 121-Pin MAP-BGA Tray

NXP Semiconductors
Datasheets 

The MK64FX512VDC12 microcontroller from NXP Semiconductors is designed for budget-friendly, low-power applications that require USB or Ethernet connectivity. Built on an ARM Cortex-M4 Core, this microcontroller offers:

  • 512KB of flash memory

  • 256KB SRAM

  • Up to 83 I/Os

The MK64FX512VDC12 microcontroller also offers a USB full-/low-speed On-the-Go controller and an Ethernet controller with MII and RMII interface. These impressive capabilities all come with a running power consumption as low as 250 μA/MHz.

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    Active
  • HTS
    COMPONENTS
  • Automotive
    No
  • PPAP
    No
  • Family Name
    K64
  • Instruction Set Architecture
    RISC
  • Device Core
    ARM Cortex M4
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    120
  • Maximum Clock Rate (MHz)
    120
  • Data Bus Width (bit)
    32
  • Program Memory Type
    Flash
  • Program Memory Size
    512KB
  • RAM Size
    256KB
  • Programmability
    Yes
  • Interface Type
    CAN/Ethernet/I2C/I2S/SPI/UART/USB
  • Number of I/Os
    86
  • No. of Timers
    10
  • PWM
    2
  • Number of ADCs
    2
  • ADC Channels
    37/37
  • ADC Resolution (bit)
    16/16
  • Number of DACs
    2
  • DAC Channels
    2
  • DAC Resolution (bit)
    12/12
  • USART
    0
  • UART
    6
  • USB
    1
  • SPI
    3
  • I2C
    3
  • I2S
    1
  • CAN
    1
  • Ethernet
    1
  • Watchdog
    1
  • Analog Comparators
    3
  • Parallel Master Port
    No
  • Real Time Clock
    Yes
  • Special Features
    CAN Controller
  • Minimum Operating Supply Voltage (V)
    1.71
  • Typical Operating Supply Voltage (V)
    2.5|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.41(Max) mm
  • Package Width
    8 mm
  • Package Length
    8 mm
  • PCB changed
    121
  • Standard Package Name
    BGA
  • Supplier Package
    MAP-BGA
  • Pin Count
    121
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources