Application Processors and SOCs

MIMX8QX6CVLFZAC

SOC i.MX 8QuadXPlus ARM Cortex A53/ARM Cortex M4F 609-Pin FBGA Tray

NXP Semiconductors

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  5A992c.

• Part Status

  Active

• HTS

  8542.31.00.70

• Automotive

  No

• PPAP

  No

• Family Name

  i.MX 8QuadXPlus

• Device Core

  ARM Cortex A53|ARM Cortex M4F

• Maximum Clock Rate (MHz)

  1200/264

• Data Bus Width (bit)

  32

• RAM Size

  256KB

• Type

  Applications Processor

• Processing Unit

  Microprocessor

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Interface Type

  CAN/Ethernet/I2C/SPI/UART/USB

• SPI

  4

• I2C

  10

• I2S

  0

• UART

  6

• USB

  2

• USART

  0

• CAN

  3

• PCI

  0

• Ethernet

  2

• Programmability

  No

• Core Architecture

  ARM

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  2.12(Max) mm

• Package Width

  21 mm

• Package Length

  21 mm

• PCB changed

  609

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  609