Application Processors and SOCs

MIMX8QP5AVUFFAB

SOC i.MX 8QuadPlus ARM Cortex A53/ARM Cortex A72/ARM Cortex M4F 28nm Automotive AEC-Q100 1313-Pin BGA Tray

NXP Semiconductors

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  5A992c.

• Part Status

  NRND

• HTS

  8542.31.00.70

• Automotive

  Yes

• PPAP

  Yes

• Family Name

  i.MX 8QuadPlus

• Device Core

  ARM Cortex A53|ARM Cortex A72|ARM Cortex M4F

• Maximum Clock Rate (MHz)

  1260/1600/266

• Data Bus Width (bit)

  32

• RAM Size

  512KB

• Type

  Applications Processor

• Processing Unit

  Microprocessor

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Interface Type

  CAN/Ethernet/I2C/I2S/SPI/UART/USB

• SPI

  4

• I2C

  18

• I2S

  4

• UART

  8

• USB

  3

• USART

  0

• CAN

  3

• PCI

  1

• Ethernet

  2

• Programmability

  No

• Core Architecture

  ARM

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  2.15(Max) mm

• Package Width

  29 mm

• Package Length

  29 mm

• PCB changed

  1313

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  1313