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MIMX8ML8DVNLZAB|NXP|simage
MIMX8ML8DVNLZAB|NXP|limage
Application Processors and SOCs

MIMX8ML8DVNLZAB

SOC i.MX 8M ARM Cortex A53/ARM Cortex M7 548-Pin LFBGA

NXP Semiconductors
Datasheets 

Embedding Intelligence at the Edge

The potential for edge nodes to become “thinkers” makes for an explosion of smarter consumer, industrial and automotive applications.

The i.MX 8M Plus family focuses on machine learning and vision, advanced multimedia, and industrial automation with high reliability. It is designed to meet the needs of Smart Home, Building, City, and Industry 4.0 applications.

Features:

-Powerful quad or dual Arm® Cortex®-A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.
-Dual image signal processors (ISPs) and two camera inputs for an effective advanced vision system.
-Multimedia capabilities include video encode (including h.265) and decode, 3D/2D graphic acceleration, and multiple audio and voice functionalities.
-Real-time control with Cortex-M7. Robust control networks supported by dual CAN FD and dual Gigabit Ethernet with Time Sensitive Networking (TSN).
-High industrial reliability with DRAM inline ECC.

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992c.
  • Part Status
    Active
  • HTS
    8542.31.00.70
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Family Name
    i.MX 8M
  • Device Core
    ARM Cortex A53|ARM Cortex M7
  • Maximum Clock Rate (MHz)
    1800/800
  • Program Memory Type
    ROM
  • Data Bus Width (bit)
    64
  • Program Memory Size
    256KB
  • RAM Size
    868KB
  • Type
    Applications Processor
  • Processing Unit
    Microcontroller
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    95
  • Interface Type
    CAN/I2C/SPI/UART/USB
  • SPI
    3
  • I2C
    6
  • I2S
    0
  • UART
    4
  • Data Cache Size
    32KB
  • USB
    2
  • Instruction Cache Size
    32KB
  • USART
    0
  • CAN
    2
  • PCI
    0
  • Ethernet
    0
  • Programmability
    No
  • Core Architecture
    ARM
  • Maximum Expanded Memory Size
    8GB
  • Mounting
    Surface Mount
  • Package Height
    1.17(Max)
  • Package Width
    15
  • Package Length
    15
  • PCB changed
    548
  • Standard Package Name
    BGA
  • Supplier Package
    LFBGA
  • Pin Count
    548

Documentation and Resources

Datasheets
Design resources