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MCIMX355AJQ5C|NXP|simage
MCIMX355AJQ5C|NXP|limage
Application Processors and SOCs

MCIMX355AJQ5C

SOC i.MX35 ARM1136JF-S 400-Pin MAP-BGA Tray Automotive AEC-Q100

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992c.
  • Part Status
    Active
  • HTS
    8542.31.00.70
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Family Name
    i.MX35
  • Device Core
    ARM1136JF-S
  • Maximum Clock Rate (MHz)
    532
  • Program Memory Type
    ROM
  • Data Bus Width (bit)
    32
  • Program Memory Size
    32KB
  • RAM Size
    128KB
  • Type
    Applications Processor
  • Processing Unit
    Microprocessor
  • PWM
    1
  • Watchdog
    1
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Interface Type
    CAN/Ethernet/I2C/I2S/SPI/UART/USB
  • SPI
    2
  • I2C
    3
  • I2S
    2
  • UART
    2
  • Data Cache Size
    16KB
  • USB
    2
  • Instruction Cache Size
    16KB
  • USART
    0
  • CAN
    2
  • PCI
    0
  • Ethernet
    1
  • Programmability
    Yes
  • Core Architecture
    ARM
  • Ethernet Speed
    10Mbps/100Mbps
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.18
  • Package Width
    17
  • Package Length
    17
  • PCB changed
    400
  • Standard Package Name
    BGA
  • Supplier Package
    MAP-BGA
  • Pin Count
    400
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources