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MCIMX31LCVMN4DR2|NXP|simage
MCIMX31LCVMN4DR2|NXP|limage
Application Processors and SOCs

MCIMX31LCVMN4DR2

SOC i.MX31 ARM1136JF-S 473-Pin MAP-BGA T/R Automotive AEC-Q100

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992c.
  • Part Status
    Active
  • HTS
    COMPONENTS
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Family Name
    i.MX31
  • Device Core
    ARM1136JF-S
  • Maximum Clock Rate (MHz)
    400
  • Program Memory Type
    ROM
  • Data Bus Width (bit)
    32
  • Program Memory Size
    32KB
  • RAM Size
    16KB
  • Type
    Applications Processor
  • Processing Unit
    Microprocessor
  • PWM
    1
  • Watchdog
    1
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Interface Type
    I2C/I2S/SPI/UART/USB
  • SPI
    3
  • I2C
    3
  • I2S
    1
  • UART
    5
  • Data Cache Size
    16KB
  • USB
    3
  • Instruction Cache Size
    16KB
  • USART
    0
  • CAN
    0
  • PCI
    0
  • Ethernet
    0
  • Programmability
    Yes
  • Core Architecture
    ARM
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    1.2(Max) mm
  • Package Width
    19 mm
  • Package Length
    19 mm
  • PCB changed
    473
  • Standard Package Name
    BGA
  • Supplier Package
    MAP-BGA
  • Pin Count
    473
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources