Application Processors and SOCs

MCIMX233DJM4C

SOC i.MX233 ARM926EJ-S 169-Pin LFBGA Tray

NXP Semiconductors

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  5A992c.

• Part Status

  LTB

• HTS

  COMPONENTS

• SVHC

  Yes

• Automotive

  No

• PPAP

  No

• Family Name

  i.MX233

• Device Core

  ARM926EJ-S

• Maximum Clock Rate (MHz)

  454

• Program Memory Type

  ROM

• Data Bus Width (bit)

  32

• Program Memory Size

  64KB

• RAM Size

  32KB

• Type

  Applications Processor

• Processing Unit

  Microprocessor

• PWM

  5

• Watchdog

  1

• Minimum Operating Temperature (°C)

  -10

• Maximum Operating Temperature (°C)

  70

• Interface Type

  I2C/I2S/SPI/UART/USB

• SPI

  2

• I2C

  1

• I2S

  2

• UART

  3

• Data Cache Size

  16KB

• USB

  1

• Instruction Cache Size

  16KB

• USART

  0

• CAN

  0

• PCI

  0

• Ethernet

  0

• Programmability

  Yes

• Core Architecture

  ARM

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.02

• Package Width

  11

• Package Length

  11

• PCB changed

  169

• Standard Package Name

  BGA

• Supplier Package

  LFBGA

• Pin Count

  169

• Lead Shape

  Ball