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MC13892DJVL|NXP|simage
MC13892DJVL|NXP|limage
PMIC Solutions

MC13892DJVL

Application Processors to 186-Pin BGA Tray

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    COMPONENTS
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Function
    Application Processors
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Packaging
    Tray
  • Maximum Storage Temperature (°C)
    150
  • Minimum Storage Temperature (°C)
    -65
  • Mounting
    Surface Mount
  • Package Height
    1.18
  • Package Width
    12
  • Package Length
    12
  • PCB changed
    186
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    186
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources