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LPC18S50FET180E|NXP|simage
LPC18S50FET180E|NXP|limage
Microcontrollers - MCUs

LPC18S50FET180E

MCU 32-bit ARM Cortex M3 2.5V/3.3V 180-Pin TFBGA Tray Automotive AEC-Q100

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A002a.1.
  • Part Status
    Active
  • HTS
    8542.31.00.25
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Family Name
    LPC1800
  • Device Core
    ARM Cortex M3
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    180
  • Maximum Clock Rate (MHz)
    180
  • Data Bus Width (bit)
    32
  • RAM Size
    200KB
  • Programmability
    No
  • Interface Type
    CAN/Ethernet/I2C/I2S/SPI/UART/USART/USB
  • Number of I/Os
    118
  • No. of Timers
    6
  • PWM
    1
  • Number of ADCs
    2
  • ADC Channels
    8/8
  • ADC Resolution (bit)
    10/10
  • Number of DACs
    1
  • DAC Channels
    1
  • DAC Resolution (bit)
    10
  • USART
    3
  • UART
    4
  • USB
    1
  • SPI
    3
  • I2C
    2
  • I2S
    2
  • CAN
    2
  • Ethernet
    1
  • Watchdog
    1
  • Parallel Master Port
    No
  • Real Time Clock
    Yes
  • Minimum Operating Supply Voltage (V)
    2.2
  • Typical Operating Supply Voltage (V)
    2.5|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Maximum Power Dissipation (mW)
    1500
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.71
  • Package Width
    12
  • Package Length
    12
  • PCB changed
    180
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    180
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources