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ISO7330FCDW|TI|simage
ISO7330FCDW|TI|limage
Digital Isolators

ISO7330FCDW

Digital Isolator CMOS 3-CH 25Mbps 16-Pin SOIC Tube

Texas Instruments

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    COMPONENTS
  • Automotive
    No
  • PPAP
    No
  • Number of Channels per Chip
    3
  • Maximum Data Rate
    25Mbps
  • Maximum Rise Time (ns)
    3(Typ)
  • Maximum Fall Time (ns)
    2(Typ)
  • Maximum Pulse Width Distortion (ns)
    4
  • Output Type
    CMOS
  • Maximum Operating Supply Voltage (V)
    5.5
  • Minimum Operating Supply Voltage (V)
    3
  • Maximum Propagation Delay Time (tPHL) (ns)
    66
  • Minimum Isolation Voltage (Vrms)
    3000
  • Maximum Propagation Delay Time (tPLH) (ns)
    66
  • Maximum Working Insulation Voltage
    1000Vrms
  • Maximum Output Current Drive (mA)
    15
  • Maximum Power Dissipation (mW)
    70
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tube
  • Typical Operating Supply Voltage (V)
    3.3|5
  • Forward/Reverse Channels
    3/0
  • Minimum Common Mode Rejection (kV/us)
    25
  • Maximum ESD Protection Voltage (kV)
    ±1.5@CDM/±4@HBM
  • Coupling Type
    Capacitive Coupling
  • Mounting
    Surface Mount
  • Package Height
    2.35(Max) mm
  • Package Width
    7.6(Max) mm
  • Package Length
    10.5(Max) mm
  • PCB changed
    16
  • Standard Package Name
    SO
  • Supplier Package
    SOIC
  • Pin Count
    16
  • Lead Shape
    Gull-wing

Documentation and Resources

Datasheets
Design resources