DRAM Chip

IS49RL36320-093FBLI

1.15Gb RLDRAM 3

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  1.15G

• Organization

  32Mx36

• Mounting

  Surface Mount

• Package Height

  0.75(Max) mm

• Package Width

  13.5 mm

• Package Length

  13.5 mm

• PCB changed

  168

• Standard Package Name

  BGA

• Supplier Package

  FCBGA

• Pin Count

  168