DRAM Chip

IS43DR82560C-25DBLI

DRAM Chip DDR2 SDRAM 2Gbit 256Mx8 1.8V 60-Pin TW-BGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR2 SDRAM

• Chip Density (bit)

  2G

• Organization

  256Mx8

• Number of Internal Banks

  8

• Number of Words per Bank

  32M

• Number of Bits/Word (bit)

  8

• Data Bus Width (bit)

  8

• Maximum Clock Rate (MHz)

  800

• Maximum Access Time (ns)

  0.4

• Address Bus Width (bit)

  18

• Interface Type

  SSTL_18

• Minimum Operating Supply Voltage (V)

  1.7

• Maximum Operating Supply Voltage (V)

  1.9

• Operating Current (mA)

  198

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  8

• Mounting

  Surface Mount

• Package Height

  1(Max) mm

• Package Width

  8 mm

• Package Length

  10.5 mm

• PCB changed

  60

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  60