Flash

IS25LX256-JHLE

NOR Flash Serial (Octal SPI) 3V/3.3V 256M-bit 32M x 8 6ns 24-Pin TFBGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  8542.32.00.71

• Automotive

  No

• PPAP

  No

• Cell Type

  NOR

• Chip Density (bit)

  256M

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  32

• Sector Size

  128Kbyte x 256

• Page Size

  256byte

• Number of Bits/Word (bit)

  8

• Number of Words

  32M

• Timing Type

  Synchronous

• Max. Access Time (ns)

  6

• Maximum Erase Time (s)

  180/Chip

• Maximum Programming Time (ms)

  1.8/Page

• Interface Type

  Serial (Octal SPI)

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3|3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Programming Voltage (V)

  2.7 to 3.6

• Operating Current (mA)

  55

• Program Current (mA)

  55

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Extended

• Command Compatible

  Yes

• ECC Support

  Yes

• Support of Page Mode

  No

• Mounting

  Surface Mount

• Package Height

  0.84(Max)

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  24