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FDV301N|ONSEMI|simage
FDV301N|ONSEMI|limage
MOSFETs

FDV301N

Trans MOSFET N-CH 25V 0.22A 3-Pin SOT-23 T/R

onsemi
Datasheets 

The ON Semiconductor MOSFET has been designed especially for low voltage applications as a replacement for digital transistors. The maximum Drain Source Voltage of the product is 25 V and Gate Source Voltage is 8V. Its maximum power dissipation is 350 mW. It has 1 number of elements per chip. This MOSFET has an operating temperature range of -55°C to 150°C.

Features and Benefits:
• 25 V, 0.22 A continuous, 0.5 A Peak. RDS(ON) = 5 W @ VGS= 2.7 V RDS(ON) = 4 W @ VGS= 4.5 V
• Very low level gate drive requirements allowing direct operation in 3V circuits. VGS(th) < 1.06V
• Gate-Source Zener for ESD ruggedness. >6kV Human Body Model
• Replace multiple NPN digital transistors with one DMOS FET.

Application:
• FDV301N is a Digital MOSFET which can be trigger ON by applying voltages as low as 2.0V to its gate. With that being the case the device can be used in all low voltage digital circuits.
• FDV301N can also be as a high speed switching device replacing all conventional transistors in digital circuits since it is specifically designed for high speed switching applications.
• The device had very low turn ON resistance which is a must condition in some applications.
• The device is also preferred for high efficiency application as the low drop during switching leads to less power loss and with less power loss the efficiency of the system will be more.

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    COMPONENTS
  • Automotive
    No
  • PPAP
    No
  • Category
    Power MOSFET
  • Configuration
    Single
  • Process Technology
    DMOS
  • Channel Mode
    Enhancement
  • Channel Type
    N
  • Number of Elements per Chip
    1
  • Maximum Drain-Source Voltage (V)
    25
  • Maximum Gate-Source Voltage (V)
    8
  • Maximum Gate Threshold Voltage (V)
    1.06
  • Operating Junction Temperature (°C)
    -55 to 150
  • Maximum Continuous Drain Current (A)
    0.22
  • Maximum Gate-Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    1
  • Maximum Drain-Source Resistance (mOhm)
    4000@4.5V
  • Typical Gate Charge @ Vgs (nC)
    0.49@4.5V
  • Typical Gate Charge @ 10V (nC)
    0.49
  • Typical Gate to Drain Charge (nC)
    0.07
  • Typical Gate to Source Charge (nC)
    0.22
  • Typical Input Capacitance @ Vds (pF)
    9.5@10V
  • Typical Reverse Transfer Capacitance @ Vds (pF)
    1.3@10V
  • Minimum Gate Threshold Voltage (V)
    0.7
  • Typical Output Capacitance (pF)
    6
  • Maximum Power Dissipation (mW)
    350
  • Typical Fall Time (ns)
    3.5
  • Typical Rise Time (ns)
    6
  • Typical Turn-Off Delay Time (ns)
    3.5
  • Typical Turn-On Delay Time (ns)
    3.2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Packaging
    Tape and Reel
  • Typical Drain-Source Resistance @ 25°C (mOhm)
    3100@4.5V|3800@2.7
  • Typical Diode Forward Voltage (V)
    0.8
  • Typical Gate Plateau Voltage (V)
    2.1
  • Maximum Diode Forward Voltage (V)
    1.2
  • Typical Gate Threshold Voltage (V)
    0.85
  • Maximum Positive Gate-Source Voltage (V)
    8
  • Mounting
    Surface Mount
  • Package Height
    0.94
  • Package Width
    1.3
  • Package Length
    2.9
  • PCB changed
    3
  • Standard Package Name
    SOT
  • Supplier Package
    SOT-23
  • Pin Count
    3
  • Lead Shape
    Gull-wing

Documentation and Resources

Datasheets
Design resources