Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
COMPONENTS
Automotive
No
PPAP
No
Category
Power MOSFET
Configuration
Dual Dual Drain
Channel Mode
Enhancement
Channel Type
N
Number of Elements per Chip
2
Maximum Drain-Source Voltage (V)
20
Maximum Gate-Source Voltage (V)
±8
Maximum Gate Threshold Voltage (V)
1.5
Operating Junction Temperature (°C)
-55 to 150
Maximum Continuous Drain Current (A)
7.5
Maximum Gate-Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Maximum Drain-Source Resistance (mOhm)
18@4.5V
Typical Gate Charge @ Vgs (nC)
23@4.5V
Typical Gate Charge @ 10V (nC)
23
Typical Gate to Drain Charge (nC)
4.4
Typical Gate to Source Charge (nC)
3.2
Typical Input Capacitance @ Vds (pF)
2130@10V
Typical Reverse Transfer Capacitance @ Vds (pF)
270@10V
Minimum Gate Threshold Voltage (V)
0.5
Typical Output Capacitance (pF)
545
Maximum Power Dissipation (mW)
2000
Typical Fall Time (ns)
23
Typical Rise Time (ns)
26
Typical Turn-Off Delay Time (ns)
65
Typical Turn-On Delay Time (ns)
13
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Packaging
Tape and Reel
Typical Drain-Source Resistance @ 25°C (mOhm)
13@4.5V|16@2.5V
Maximum Power Dissipation on PCB @ TC=25°C (W)
1.6
Maximum Pulsed Drain Current @ TC=25°C (A)
20
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
135
Typical Diode Forward Voltage (V)
0.65
Typical Gate Plateau Voltage (V)
1.6
Maximum Diode Forward Voltage (V)
1.2
Typical Gate Threshold Voltage (V)
0.8
Maximum Positive Gate-Source Voltage (V)
8
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
7.5
Mounting
Surface Mount
Package Height
1.5(Max) mm
Package Width
3.9 mm
Package Length
4.9 mm
PCB changed
8
Standard Package Name
SO
Supplier Package
SOIC
Pin Count
8
Lead Shape
Gull-wing