SRAM Chip

CY7C1423KV18-300BZC

SRAM Chip Sync Dual 1.8V 36M-bit 2M x 18 0.45ns 165-Pin FBGA Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Not Compliant

• ECCN (US)

  3A991b.2.a.

• Part Status

  Obsolete

• HTS

  CY7C1423KV18-300BZC

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  36M

• Number of Words

  2M

• Number of Bits/Word (bit)

  18

• Architecture

  Pipelined

• Data Rate Architecture

  DDR

• Address Bus Width (bit)

  20

• Number of Ports

  2

• Timing Type

  Synchronous

• Max. Access Time (ns)

  0.45

• Maximum Clock Rate (MHz)

  300

• Minimum Operating Supply Voltage (V)

  1.7

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  1.9

• Operating Current (mA)

  460

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.89

• Package Width

  13

• Package Length

  15

• PCB changed

  165

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  165

• Lead Shape

  Ball