SRAM Chip

CY7C1383KV33-133AXI

SRAM Chip Sync Dual 3.3V 18M-bit 1M x 18 6.5ns 100-Pin TQFP Tray

Infineon Technologies AG

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.2.b.

• Part Status

  Active

• HTS

  8542.32.00.41

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  18M

• Number of Words

  1M

• Number of Bits/Word (bit)

  18

• Architecture

  Flow-Through

• Data Rate Architecture

  SDR

• Address Bus Width (bit)

  3

• Number of Ports

  2

• Timing Type

  Synchronous

• Max. Access Time (ns)

  6.5

• Maximum Clock Rate (MHz)

  133

• Process Technology

  65nm

• Minimum Operating Supply Voltage (V)

  3.135

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  129

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.4

• Package Width

  14

• Package Length

  20

• PCB changed

  100

• Standard Package Name

  QFP

• Supplier Package

  TQFP

• Pin Count

  100

• Lead Shape

  Gull-wing