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CY62167GE3045BVXIT|INFINEON|simage
CY62167GE3045BVXIT|INFINEON|limage
SRAM Chip

CY62167GE30-45BVXIT

SRAM Chip Async Single 2.5V/3V/3.3V 16M-bit 1M x 16 45ns 48-Pin VFBGA T/R

Infineon Technologies AG
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.2.a
  • Part Status
    Active
  • HTS
    8542.32.00.41
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    16M
  • Number of Words
    1M
  • Number of Bits/Word (bit)
    16
  • Data Rate Architecture
    SDR
  • Address Bus Width (bit)
    20
  • Number of Ports
    1
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    45
  • Process Technology
    65nm
  • Minimum Operating Supply Voltage (V)
    2.2
  • Typical Operating Supply Voltage (V)
    2.5|3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    36
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    0.81(Max)
  • Package Width
    6
  • Package Length
    8
  • PCB changed
    48
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    48
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources