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C2Q750|BEL_FUSE|simage
C2Q750|BEL_FUSE|limage
Fuses

C2Q 750

Fuse Chip Very Fast Acting 0.75A 32V SMD Solder Pad 0603 Ceramic CE/UL

Bel
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8536.10.00.40
  • Automotive
    No
  • PPAP
    No
  • Type
    Chip
  • Acting
    Very Fast
  • Application
    Industrial Equipment|LCD Monitor|Medical Equipment|Notebook|Office Electronic Equipment|Power Supply
  • Fuse Size (mm)
    1.6 X 0.82 X 0.48
  • Current Rating (A)
    0.75
  • Maximum Voltage Rating (V)
    32
  • Maximum AC Voltage Rating (V)
    32
  • Maximum DC Voltage Rating (V)
    63
  • Maximum Power Dissipation (W)
    0.12
  • Typical Melting I2t (A²S)
    0.0005
  • Typical Cold Resistance (Ohm)
    0.17
  • Termination Style
    Solder Pad
  • Number of Terminals
    2
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tape and Reel
  • Product Depth (mm)
    0.82
  • Product Length (mm)
    1.6
  • Product Height (mm)
    0.48
  • Fuse Material
    Ceramic
  • Mounting
    Surface Mount
  • Package/Case
    0603

Documentation and Resources

Datasheets
Design resources