The BGM13S32F512GA-V2 from Silicon Labs is their first SiP module solution for Bluetooth 5.0 LE applications. This wireless unit comes with 512kB of flash memory and 64kB of RAM, allowing it to meet Bluetooth Mesh networking requirements. With low energy consumption, a minuscule 6.5mm x 6.5mm footprint, regulatory test certificates from a range of countries, and support for 2 Mpbs, 1 Mbps, and coded LE Bluetooth PHYs, this unit is well suited for a huge variety of applications, including IoT, wearables, smartphone accessories, and home automation.
Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
5A992c.
Part Status
Obsolete
HTS
8525.60.10.50
Automotive
No
PPAP
No
Type
Module
Protocols Supported
Bluetooth v5.0 (BLE)
Maximum Data Rate (Mbps)
2
Minimum Operating Frequency (MHz)
2400
Maximum Operating Frequency (MHz)
2483.5
Typical Sensitivity (dBm)
-102.1
Interface Type
GPIO/I2C/UART
Minimum Operating Supply Voltage (V)
1.8
Maximum Operating Supply Voltage (V)
3.6
Antenna Mounting
On Board
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Mounting
Surface Mount
Package Height
1.3 mm
Package Width
6.5 mm
Package Length
6.5 mm
PCB changed
51
Supplier Package
SMD
Pin Count
51