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101020192|SEEED|simage
101020192|SEEED|limage
Sensor Development Boards and Kits

101020192

BMP280 Board Mount Pressure Sensor Grove Board

Seeed Technology Co.,Ltd
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    2B230
  • Part Status
    Active
  • HTS
    8542.39.00.90
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Type
    Grove Board
  • Supported Device
    BMP280
  • Supported Device Technology
    Board Mount Pressure
  • Interface Type
    I2C/SPI
  • Operating Supply Voltage Range (VDC)
    3.3(Typ)|5(Typ)
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Product Weight (g)
    3
  • Product Length (mm)
    40
  • Product Depth (mm)
    20

Documentation and Resources

Datasheets
Design resources