Stiftleisten
WTB26SAD9SY
Conn Wire to Board RCP 26 POS 1.27mm Solder ST Top Entry Thru-Hole AirBorn
AirbornW Series
AirBorn W Series Connectors, from Molex, meet the MIL-DTL-55302 standard and are widely relied upon across Military, Defense, and Industrial sectors. When the stakes are high and failure is not an option, these durable connectors deliver consistent performance, even under the most demanding and harsh environmental conditions.
Rugged PCB Connectors - AirBorn W Series
Additional content
- Download Product Catalog: W Series .100 PCB Connector Catalog .pdf
Key Features
- 0.100" (2.54mm) contact spacing
- 1, 2, 3, 4 & miscellaneous row options
- 3-208 contacts
- Field proven, flight-heritage technology used in the Space Shuttles, Mars Rovers and the GOES-16 & Milstar Satellites
- 3 reliable points-of-contact
- Straight, right-angle, card-edge, I/O & connector saver
- Plastic body
- MIL-DTL-55302 qualification
Industries
- Military & Defense
- Aerospace
- Medical Equipment
Produktspezifikationen
RoHS EU
Compliant
ECCN (USA)
EAR99
Part Status
Active
Automotive
No
PPAP
No
Typ
Wire to Board
Geschlecht
RCP
Anzahl der Kontakte
26
Anzahl der Reihen
2
Abschlussverfahren
Solder
Anschlussraster (mm)
1.27
Körperausrichtung
Straight
Reihenabstand (mm)
2.54
Nenngeschwindigkeit (Gbps)
1
Max. Nennstrom (A)
5
Max. Nennspannung
1000V
Isolationswiderstand (MOhm)
5000
Max. Kontaktwiderstand (mOhm)
5
Mindestbetriebstemperatur (°C)
-65
Max. Betriebstemperatur (°C)
125
Passzyklus (Cycles)
500
Produktlänge (mm)
54.61
Produkttiefe (mm)
6.35
Produkthöhe (mm)
11.81
Handelsname
AirBorn
Befestigung
Through Hole