Flash
PC28F256P33TFE
NOR Flash Parallel/Serial 2.5V/3V/3.3V 256M-bit 16M x 16 95ns 64-Pin EBGA Tray
Micron TechnologyProduktspezifikationen
EU RoHS
Compliant
ECCN (US)
3A991b.1.a.
Part Status
Obsolete
HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
NOR
Chip Density (bit)
256M
Architecture
Sectored
Boot Block
Yes
Block Organization
Asymmetrical
Location of Boot Block
Top
Address Width (bit)
24
Sector Size
32Kbyte x 4|128Kbyte x 255
Page Size
16Words
Number of Bits/Word (bit)
16
Number of Words
16M
Programmability
Yes
Timing Type
Asynchronous|Synchronous
Max. Access Time (ns)
95
Maximum Erase Time (s)
4
Maximum Page Access Time (ns)
25
Maximum Programming Time (ms)
0.456/Word
OE Access Time (ns)
25
Process Technology
65nm
Interface Type
Parallel|Serial
Maximum Operating Frequency (MHz)
52
Minimum Operating Supply Voltage (V)
2.3
Typical Operating Supply Voltage (V)
2.5|3|3.3
Maximum Operating Supply Voltage (V)
3.6
Programming Voltage (V)
8.5 to 9.5
Operating Current (mA)
31
Page Read Current (mA)
16
Program Current (mA)
50
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Command Compatible
Yes
ECC Support
Yes
Support of Page Mode
Yes
Minimum Endurance (Cycles)
100000
Packaging
Tray
Mounting
Surface Mount
Package Height
0.78
Package Width
10
Package Length
13
PCB changed
64
Standard Package Name
BGA
Supplier Package
EBGA
Pin Count
64
Lead Shape
Ball