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FX2380S0.5SV|HIROSE|simage
FX2380S0.5SV|HIROSE|limage
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FX23-80S-0.5SV

Conn Board to Board RCP 4Power/80Signal POS 0.5mm Solder ST Top Entry SMD/Thru-Hole FunctionMAX™ Tray

Hirose Electric
Datenblätter 

Produktspezifikationen
  • RoHS (Unione Europea)
    Compliant
  • ECCN (Stati Uniti)
    EAR99
  • Stato del componente
    Active
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Unknown
  • Type
    Board to Board
  • Gender
    RCP
  • Number of Contacts
    4Power/80Signal
  • Number of Rows
    2
  • Termination Method
    Solder
  • Terminal Pitch (mm)
    0.5
  • Body Orientation
    Straight
  • Speed Rating (Gbps)
    8
  • Maximum Current Rating (A)
    3/0.5
  • Maximum Voltage Rating
    200VAC/50VAC
  • Insulation Resistance (MOhm)
    1000/100
  • Maximum Contact Resistance (mOhm)
    20/70
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    105
  • Mating Cycle (Cycles)
    100
  • Packaging
    Tray
  • Product Weight (g)
    1.36
  • Product Length (mm)
    32.2
  • Product Depth (mm)
    7.6
  • Product Height (mm)
    6.8
  • Tradename
    FunctionMAX™
  • Contact Plating Thickness
    (0.1/1.3)um
  • Mounting
    Surface Mount/Through Hole
Bestellmenge

Dokumentation und Ressourcen

Datenblätter
Design-Ressourcen