DLPC230STZDQQ1|TI|limage
DLPC230STZDQQ1|TI|simage
Spezialisierte Stromversorgungs-ICs und -Module

DLPC230STZDQQ1

Digital Micromirror Device 324-Pin BGA Tray Automotive AEC-Q100

Texas Instruments

Produktspezifikationen
  • RoHS (Unión Europea)
    Compliant
  • ECCN (Estados Unidos)
    EAR99
  • Estatus de pieza
    Active
  • Código HTS
    8542.31.00.30
  • SVHC
    Yes
  • Automotive
    Yes
  • PPAP
    Yes
  • Type
    Digital Micromirror Device
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Supplier Temperature Grade
    Automotive
  • Mounting
    Surface Mount
  • Package Height
    1.73
  • Package Width
    23.2(Max)
  • Package Length
    23.2(Max)
  • PCB changed
    324
  • Standard Package Name
    BGA
  • Supplier Package
    BGA
  • Pin Count
    324

Dokumentation und Ressourcen

Datenblätter
Design-Ressourcen