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SN74LVC1G373YZPR|TI|simage
SN74LVC1G373YZPR|TI|limage
锁存器

SN74LVC1G373YZPR

Latch Transparent 3-ST 1-CH D-Type 6-Pin DSBGA T/R

Texas Instruments

产品技术规范
  • 欧盟RoHS指令
    Compliant
  • 美国出口管制分类ECCN编码
    EAR99
  • 环保无铅
    Active
  • 美国海关商品代码
    8542.39.00.90
  • Automotive
    No
  • PPAP
    No
  • Type
    D-Type
  • Logic Family
    LVC
  • Latch Mode
    Transparent
  • Number of Channels per Chip
    1
  • Number of Elements per Chip
    1
  • Number of Inputs per Chip
    1
  • Number of Input Enables per Element
    1
  • Number of Selection Inputs per Element
    0
  • Number of Outputs per Chip
    1
  • Number of Output Enables per Element
    1
  • Bus Hold
    No
  • Set/Reset
    No
  • Polarity
    Non-Inverting
  • Maximum Propagation Delay Time @ Maximum CL (ns)
    5.4@3.3V|4@5V
  • Absolute Propagation Delay Time (ns)
    17.4
  • Output Type
    3-State
  • Maximum Low Level Output Current (mA)
    32
  • Maximum High Level Output Current (mA)
    -32
  • Minimum Operating Supply Voltage (V)
    1.65
  • Typical Operating Supply Voltage (V)
    1.8|2.5|3.3|5
  • Maximum Operating Supply Voltage (V)
    5.5
  • Tolerant I/Os (V)
    5.5 Inputs
  • Maximum Quiescent Current (uA)
    10
  • Propagation Delay Test Condition (pF)
    50
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Commercial
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    0.31(Max)
  • Package Width
    0.92(Max)
  • Package Length
    1.42(Max)
  • PCB changed
    6
  • Standard Package Name
    BGA
  • Supplier Package
    DSBGA
  • Pin Count
    6
  • Lead Shape
    Ball
订单数量

文档和资源

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